Application scenario: Suitable for high-density components in servers and electronic devices.
Technical Highlights:
• An economical and efficient alternative to 3D heat-dissipating plates.
• The multi-axis cavity design enables efficient heat conduction for high-density components.
• By adopting an optimized assembly process, the material and manufacturing costs have been significantly reduced.
• Implementing process automation can shorten the delivery time and simultaneously increase the yield rate.

Application scenario: Specifically designed for high-end GPUs, ensuring rapid heat dissipation and maintaining stable cooling performance.
Technical Highlights:
• Power consumption corresponding to: Mid-to-high-end AI inference or graphics processing applications.
• Equipped with multiple heat pipes and enhanced fin structures, it can effectively handle continuous high-load operations and is suitable for edge AI terminals and professional workstations.
• Maintain optimal GPU performance during high-power operation.
• Provide stable cooling effect in both horizontal and vertical installations.
• Employ the feather copper biomimetic nano-cooling technology, which achieves efficient heat dissipation by precisely controlling the diameter and length of copper powder fibers.
The capillary force and permeability are stronger, ensuring stable heat dissipation performance under continuous high-load conditions.

Application scenario: A liquid cooling heat dissipation component used for cooling high-power core components of servers.
Technical Highlights:
• A copper tube heat conduction structure and liquid cooling channel are designed in synergy. By optimizing the flow path layout and heat exchange route, the overall heat dissipation efficiency is enhanced.

Application scenario: The product is applied in AI servers, switches and high-speed optical communication equipment, ensuring the stable operation of optical modules in environments with high bandwidth and high power density.
Technical Highlights:
• By using high thermal conductivity metal substrates and optimizing the design of internal channels, efficient heat exchange and stable liquid flow distribution are achieved.
• It has excellent thermal resistance control capability and reliable sealing performance, which can effectively reduce the operating temperature of the optical module, improve system stability and the long-term reliability of communication equipment.

Application scenario: Used for heat management of the server power distribution unit (PDB).
Technical Highlights:
• By using high thermal conductivity aluminum alloy materials and a high-density fin structure design, a balance between high heat dissipation efficiency and low air flow resistance is achieved.
• It can continuously and stably dissipate heat in the high-power density AI server operating environment, ensuring the long-term stable operation of the power supply system.
• It guarantees the stability and reliability of the power supply system under high-power density operating conditions.

Application scenario: Core connection components specially designed for high-performance server high-density liquid cooling systems, offering structures such as straight insertion, bent insertion, and Mini.

Technical Highlights:

• It exhibits high flow rate and low pressure loss performance. It is compatible with the cold plates of international leading customers' series and the Manifold liquid path platform. Among them, the MQD manual locking plug-in is simple and reliable, with a foolproof design, and can achieve high cooling connection density.
• MQDB can be inserted blindly through a guiding mechanism, and it supports compensation for axial and radial deviations within a certain range, enabling efficient hot swapping.

Application scenario: Core liquid distribution unit within the tray, enabling precise distribution of coolant within the tray.

Technical Highlights:

• It features low thermal resistance, low voltage drop and zero leakage, significantly simplifying deployment and maintenance.

Application scenario: Establish a cooling circuit connection with each server through the liquid cooling pipeline, and achieve "main trunk - branch" rapid connection through QD.

Technical Highlights:

• The product adopts a dual-path parallel architecture to achieve precise and balanced distribution of the entire rack's traffic.

• Equipped with a high-density blind-insert quick-connect array, it supports minute-level hot-swapping of the computing tray, significantly simplifying deployment and operation.

• It features redundant sealing and zero leakage protection, with low flow resistance and high reliability. It can effectively reduce system power consumption and optimize the PUE of data centers, making it a key infrastructure for large-scale AI liquid cooling deployments.

Application scenario: Used for structural support, electromagnetic shielding and auxiliary function realization in server systems.
Technical Highlights:
• It has excellent structural strength and dimensional stability.
• It has good electromagnetic shielding performance and system compatibility.
• It supports customized design requirements for various server platforms.

Application scenario: Used for high-current power transmission and distribution in server power systems, for high-power power supplies, power distribution units, and various load equipment.

Technical Highlights:

• It has dedicated design schemes for multiple products.
• It has excellent conductivity and large current carrying capacity.
• It effectively reduces contact resistance and power loss, improving conductivity stability and oxidation resistance.
• It can adapt to the thermal expansion of equipment and changes in assembly tolerances, ensuring the long-term reliable operation of the system.

Application scenario: The power module is an isolated converter with power management bus communication, suitable for supercomputers and high-performance servers.

Technical Highlights:

• With a compact mechanical structure and high-density integrated design, it achieves a high power density and significantly saves installation space.
• Through advanced topology and component optimization, it greatly reduces energy loss and heat load.
• The built-in power management bus digital control interface supports real-time monitoring, configuration and system management; the full isolation design of input/output enhances electrical safety and anti-interference capability.
• Support for parallel operation makes it convenient for flexible power expansion and redundant backup, providing an efficient, intelligent and scalable power solution for systems with high reliability and high power requirements.

Application scenario: The company's CRPS (General Redundant Power Supply) product line offers a full range of efficient and reliable front-end power solutions for data centers, high-performance servers, storage, and communication systems.

Technical Highlights:

• The product covers two major DC bus systems: 54V and 12V. The power range is from 800W to 4000W, and all adopt the standard compact CRPS hot-swappable design.
• It supports N+1 or N+N redundant architectures. The entire series features a wide range of AC and high-voltage DC mixed input, high conversion efficiency, strict voltage regulation, forced air cooling, and high reliability.
• It has obtained major global safety certifications.