The company serves global leading technology clients and offers integrated thermal management solutions ranging from various material heat sinks (VC) to AI terminals. The core product portfolio includes products made of stainless steel, composite materials, aerospace-grade titanium, and 3D dual heat sources, covering a wide range of materials and forms. The aim is to significantly enhance the thermal performance limit of the terminals. The company's ultra-thin heat sinks and overall cooling solutions have been successfully installed on multiple mid-to-high-end smartphones and achieved large-scale mass production. Among them, the stainless steel VC solution ensures high structural strength and excellent heat dissipation efficiency while significantly reducing weight, and is widely applicable to high-end flagship models. The pure titanium VC solution is specially designed for foldable screen phones and ultra-high-end models, leveraging the properties of titanium to achieve ultimate lightweight and thinning.

The company's self-production rate of ODM+ structural components reaches 95%. The company has the technical and capacity to produce various adapters. The core technologies include: injection molding, stamping, magnetic materials, die-cutting, and cold forging.

The company offers various wall adapter options: 45W, 65W, 67W, 120W, 68W, 125W.
Travel adapter: 45W, 65W, 100W, 140W;
Game adapter: 180W, 200W, 230W, 280W, 330W;
Standard adapters: 65W, 90W, 130W.