AI Terminal
Focus on providing one-stop solutions for global customers
Materials
The company is dedicated to developing composite and functional materials that are crucial for the performance, reliability and miniaturization of the next-generation AI terminal devices. The company's capabilities cover the research, design and large-scale production of high-precision materials required for the manufacturing of AI terminal devices, including carbon fiber composite materials, protective films, foam materials, tapes and magnetic materials. These materials are classified into three major categories based on their functions: (i) electronic functional materials, which possess physical properties such as electricity, magnetism, sound, light and heat, and directly participate in signal detection, transmission and processing; (ii) composite materials; and (iii) process and auxiliary materials, which are indispensable components in the manufacturing process of AI terminal device components and substrates.
Thermal management products and solutions
By utilizing copper, stainless steel, aerospace-grade titanium alloys and innovative composite materials, the company continuously pursues the lightweight and performance-enhanced design of heat sinks. It provides stainless steel heat sinks, composite material heat sinks, aerospace-grade titanium heat sinks and 3D dual-source heat sinks to the core products of global leading technology customers. At the same time, it offers integrated thermal management solutions for AI terminal devices. The company's thermal management products and solutions enable devices to maintain stable operating temperatures, thereby enhancing efficiency and reliability, achieving continuous performance output, and providing users with a smooth usage experience.
AI terminal power supply
The company's AI terminal power products are designed to establish a battery power management system with high reliability, high efficiency, and long battery life. In response to the high power and continuous stable power supply requirements of AI hardware, the company utilizes advanced power management technologies to provide stable, efficient, and long-lasting charging and power supply management, thereby providing strong impetus for the ultimate experience of AI terminals.
Foldable screen
In the field of foldable terminal hardware, the company focuses on providing one-stop solutions for global leading customers. The core products include foldable screen support components and midframes made of stainless steel/titanium alloy/carbon fiber, VC heat sinks made of copper/stainless steel/steel-copper composite/aluminum alloy/titanium, foldable screen hinge modules, die-cut functional components/structural components, chargers and other key components. These are widely used in dual-fold screen mobile phones, wide-fold screen devices, three-fold screen devices, foldable screen laptops, and vehicle flexible screens and other terminal electronic products.
AI glasses and XR wearable devices
The company has been deeply engaged in the fields of AI glasses and XR wearable devices. It comprehensively covers soft functional components, injection molded parts, heat dissipation solutions, chargers and other core hardware products for AR, VR, MR and AI glasses among other intelligent wearable devices. It also collaborates closely with terminal brands and is committed to becoming a leading supplier of core hardware and key technologies for intelligent wearable devices.
Images and Displays
The company is a leading supplier in the field of imaging and display components and modules, dedicated to providing products that integrate advanced functions, exquisite design, and reliable quality. Its products are applied in multiple flagship models of global technology-leading enterprises and continuously iterate in coordination with customer product updates, meeting the growing demand for outstanding imaging performance. The related precision functional components are widely used in the smartphone sector and are increasingly expanding to other AI terminal devices. The company also provides advanced display-related modules as the key interaction interface of intelligent devices. The product design of the company can enhance the overall user experience of smartphones and tablets. By focusing on quality and reliability, and closely cooperating with customers in development and iteration, we can enhance the differentiation advantage of products and improve market competitiveness.
Sensors and related modules
The company is dedicated to developing and manufacturing precise components and modules for sensors, serving a wide range of AI terminal devices, such as smartphones, laptops and keyboards. By integrating advanced materials, automated production processes and strict quality control, the company provides reliable high-performance products, thereby enhancing the functionality, durability and user experience of the devices.
Materials
Display frame application
Application scenario: Primarily used to fix the optical film on the screen module and achieve sealing effect. Through a closed structure, the optical film is fixed at the edge of the screen, forming a waterproof and dust-proof barrier. 。
• Can enhance the dust-proof level of the equipment.
• IP6X can enhance the moisture-proof performance by more than 300%.
• The waste materials, after being re-rolled, can be used for processing small-sized products, thus achieving resource recycling.
• Can enhance the dust-proof level of the equipment.
• IP6X can enhance the moisture-proof performance by more than 300%.
• The waste materials, after being re-rolled, can be used for processing small-sized products, thus achieving resource recycling.
Silicone products
Application scenario: It is used to be attached below the screen to provide shock absorption and buffering functions.
Technical Highlights:
• Hot press molding & flat die-cutting integration, standard structure SMT equipment for automated assembly of surface mount components, and special structure cross-type automated surface mount assembly.
• 100% automatic appearance inspection.
Technical Highlights:
• Hot press molding & flat die-cutting integration, standard structure SMT equipment for automated assembly of surface mount components, and special structure cross-type automated surface mount assembly.
• 100% automatic appearance inspection.
MnZn soft magnetic ferrite material
Application scenario: It can be manufactured into various electronic transformers, switching power supplies, inverters, filters, chokes, inductors, etc., and is widely used in consumer electronics, new energy vehicles, network communications, and other fields.
Technical highlights: It features high magnetic permeability, high impedance, low loss, and the ease of being processed into various shapes.
Technical highlights: It features high magnetic permeability, high impedance, low loss, and the ease of being processed into various shapes.
Ceramic fiber products
Application scenario: Ceramic fiber sheets, when embedded in plastic, can enhance the strength of the HSG connection point.
Technical Highlights:
• Achieving fully automated production results in high efficiency and low costs.
• The product quality is stable.
• The product dimensions are stable.
Technical Highlights:
• Achieving fully automated production results in high efficiency and low costs.
• The product quality is stable.
• The product dimensions are stable.
Microwave dielectric ceramics
Application scenario: A new type of ceramic material used as a dielectric material in microwave frequency circuits and capable of performing one or more functions.
Technical Highlights:
• The dielectric constant is standardized to meet various design requirements.
• High stability, with a frequency-temperature coefficient approaching zero.
• High-quality factor, low loss.
• The product is small in size.
Technical Highlights:
• The dielectric constant is standardized to meet various design requirements.
• High stability, with a frequency-temperature coefficient approaching zero.
• High-quality factor, low loss.
• The product is small in size.
Carbon fiber products - Hinge parts
Application scenario: As a key component of the screen support plate, it is gradually replacing stainless steel materials and entering the foldable mobile phone industry.
Technical Highlights:
• It has the characteristics of high strength, low density, good modulus, and also excellent conductivity and heat dissipation performance.
Thermoplastic carbon fiber products
Application scenario: Thermoplastic carbon fiber products refer to those formed by embedding the fiber-woven material that has been impregnated with resin in a mold in a wet state, then undergoing multiple steps of hot pressing molding, followed by processes such as spraying hardening and CNC machining.
Technical Highlights:
• The product is of high strength.
• The product is heat-resistant and corrosion-resistant.
• Quickly solidifies, highly efficient production, can quickly demold, production cycle is 8 minutes.
Electromagnetic shielding material
Application scenario: Electromagnetic shielding product. This product ensures that electronic devices neither interfere with other devices nor are affected by them.
Technical Highlights:
• The product has high precision and the dimensional tolerance can be within the range of ±0.05mm.• The product sizes and specifications are diverse, and the processing dimensions of the products range from 0.1mm to 2000mm.
• The product has a complex structure with multiple functions combined; 3D shape processing is involved.
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Thermal management products and solutions
Smartphone battery housing
Application scenario: Provide a casing for smartphone batteries that offers both protective and heat dissipation functions.
Technical Highlights:
• Impact resistance and durability.
• Improve the cooling performance of the battery.
Technical Highlights:
• Impact resistance and durability.
• Improve the cooling performance of the battery.
Smartphone metal body frame
Application scenario: As a key structural component of the smartphone, it supports other components and enhances heat conduction through the heat sink.
Technical highlights: Combined with the heat sink technology to enhance the overall heat dissipation efficiency.
Technical highlights: Combined with the heat sink technology to enhance the overall heat dissipation efficiency.
3D dual-heat-source uniform heating plate
Application scenario: Applied to the flagship models of major domestic manufacturers, it is used to dissipate heat for system-level chips (SoC) and camera modules respectively.
Technical Highlights:
• The oversized double wings and surface design provide a larger heat dissipation area and significantly enhance the heat dissipation effect.
• The three-dimensional raised structure enhances the heat transfer efficiency.
• The dual-path ring pump enables independent heat dissipation for the system-level chip (SoC) and the camera module.
Technical Highlights:
• The oversized double wings and surface design provide a larger heat dissipation area and significantly enhance the heat dissipation effect.
• The three-dimensional raised structure enhances the heat transfer efficiency.
• The dual-path ring pump enables independent heat dissipation for the system-level chip (SoC) and the camera module.
Stainless steel heat exchanger plate
Application scenario: The heat-dissipating plates made of new materials not only maintain strength but also reduce weight and decrease thickness. They are used in high-end smartphones and other AI terminal devices, which can lower the temperature of the chips and prevent performance degradation.
Technical Highlights:
• Stainless steel boasts outstanding strength. Under the condition of meeting the same performance and size requirements, stainless steel can achieve significant weight reduction and thinner thickness compared to traditional copper heat exchangers.
Steel-copper composite heat exchanger plate
Application scenario: The heat-dissipating plates made of new materials not only maintain strength but also reduce weight and decrease thickness. They are used in high-end smartphones and other AI terminal devices, which can lower the temperature of the chips and prevent performance degradation.
Technical Highlights:
• The first heat sink design that integrates the substrate of a smartphone with the heat sink in a single component.• This integrated solution of heat sink and substrate significantly enhances the overall system's heat dissipation performance and structural strength.
Aviation-grade titanium heat exchanger plate
Application scenario: The heat-dissipating plates made of new materials not only maintain strength but also reduce weight and decrease thickness. They are used in high-end smartphones and other AI terminal devices, which can lower the temperature of the chips and prevent performance degradation.
Technical Highlights:
• It has extremely high strength-to-weight ratio and lightweight characteristics. Under the same structural design, it is lighter than copper and stainless steel.Hide
AI terminal power supply
Wireless charger housing
Application scenario: Aluminum casing of the wireless charger.
Technical Highlights:
• Provide lasting protection.
• Specialized PCD forming tools with excellent appearance quality.
Technical Highlights:
• Provide lasting protection.
• Specialized PCD forming tools with excellent appearance quality.
Charger plug
Application scenario: The precise structure and electrical components of the charger.
Technical Highlights:
• Strict tolerances ensure uniformity of insertion and removal feel.
• Full bright band punching enables cost optimization.
• The nickel-cobalt surface coating is applied to enhance durability and wear resistance.
Technical Highlights:
• Strict tolerances ensure uniformity of insertion and removal feel.
• Full bright band punching enables cost optimization.
• The nickel-cobalt surface coating is applied to enhance durability and wear resistance.
Planar transformer
Application scenario: Core modules in chargers and switching power supplies, providing functions of energy transmission, voltage conversion and isolation.
Technical Highlights:
• Compact size and highly integrated.
• Fast iteration is achieved through simulation-driven design.
• Proprietary electromagnetic interference compensation technology.
Technical Highlights:
• Compact size and highly integrated.
• Fast iteration is achieved through simulation-driven design.
• Proprietary electromagnetic interference compensation technology.
Miniaturized GaN charger
Application scenario: A fast charger suitable for laptops, tablets and smartphones.
Technical Highlights:
• Multi-device fast charging technology, compliant with PD3.1 standard, supports the latest notebook computer fast charging.• Compact in size, wide voltage input, a hybrid transformer integrating planar high-frequency performance and traditional winding compact design.
• Thermal simulation optimized for temperature control.
• A simplified structure using one mainboard and one small card realizes the standardization and stability of the manufacturing process.
High-power adapter
Application scenario: Power supply for computers and other terminal devices.
Technical Highlights:
• Multi-port PD charging, supporting dynamic current distribution.• Flat transformer design, enhancing efficiency and EMC shielding effect.
• Flat wire winding of inductors, achieving stable impedance and efficient filtering performance.
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Foldable screen
Carbon fiber support plate - mobile phone
Application scenario: As the main supporting component of the foldable screen.
Technical Highlights:
• Significantly reduce the weight, with a 81% reduction compared to the weight of stainless steel.
• Using T700, T800 and M40 grade carbon fibers, the material performance has been significantly enhanced.
• The introduction of laser technology has eliminated the need for chemical solutions on the metal support plates, significantly enhancing the automation of the process and increasing efficiency.
• The company has independently developed a physical etching process, which enables the processing of carbon fiber patterns and increases efficiency by 30 times.
Carbon fiber support plate - PC
Application scenario: As the main supporting component of the foldable screen.
Technical Highlights:
• Significantly reduce the weight, with a reduction of 110g compared to stainless steel.
• Using T700 and M40 grade carbon fibers, the material performance has been significantly enhanced.
• Introduce the carbon fiber PVD process, reducing the overall thickness by 0.03mm.
• Ultraviolet picosecond laser cutting, with a cutting accuracy of ±0.03mm
Stainless steel support plate
Application scenario: As the main supporting component of the foldable screen.
Technical Highlights:
• Import double-sided chemical etching patterns in the bending area.
• Introduce the blind slot semi-etching process to meet the customer's design requirements for water droplet shapes.
Titanium alloy support plate
Application scenario: As the main supporting component of the foldable screen.
Technical Highlights:
• Significantly reduce the weight, with a reduction of 43.1% compared to the weight of stainless steel.
• Process integration and auxiliary material integration are carried out in the support plate component, reducing the assembly loss at the downstream stage.
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AI glasses and XR wearable devices
TWS Headphone Product Structure
Application scenario: The structural components of TWS (True Wireless Stereo) headphones are a combination of parts that provide both appearance and functional support for the entire headphones.
Technical Highlights:
• The processing accuracy of the molds is very high (within 0.005mm).
• It has the characteristics of a large quantity, high appearance requirements, and complex structure.
Technical Highlights:
• The processing accuracy of the molds is very high (within 0.005mm).
• It has the characteristics of a large quantity, high appearance requirements, and complex structure.
Smart earphone earpiece
Application scenario: Headphone structural components, serving both in terms of appearance design and functional support.
Technical Highlights:
• Supporting complex structures in a confined space with high forming accuracy.
• 3D cooling channel design.
Technical Highlights:
• Supporting complex structures in a confined space with high forming accuracy.
• 3D cooling channel design.
Hinge - Wireless Earphone Accessories
Application scenario: Precision rotating shaft for wireless headphones housing.
Technical Highlights:
• Meets multiple A-level appearance surface requirements.
• Achieve stable and smooth opening and closing as well as rotation.
Technical Highlights:
• Meets multiple A-level appearance surface requirements.
• Achieve stable and smooth opening and closing as well as rotation.
Mesh product
Application scenario: The protective mesh cover for the acoustic module, providing sound output, and featuring dust-proof and water-resistant properties.
Technical Highlights:
• Physical vapor deposition surface treatment achieves an advanced A+ finish, presenting a beautiful and elegant appearance.
Technical Highlights:
• Physical vapor deposition surface treatment achieves an advanced A+ finish, presenting a beautiful and elegant appearance.
Acoustic products
Application scenario: Acoustic components with dust-proof, water-proof, noise-reducing and sound-filtering functions.
Technical Highlights:
• Complex structure, capable of achieving multiple functions in a single component.
• Strict dimensional tolerances ensure reliable acoustic performance.
• 3D shape processing.
Technical Highlights:
• Complex structure, capable of achieving multiple functions in a single component.
• Strict dimensional tolerances ensure reliable acoustic performance.
• 3D shape processing.
XR Wireless Charging
Application scenario: Wireless charging module for XR devices.
Technical Highlights:
• Adaptive coupling design method and waterproof/dustproof design.
• Low-power standby and coil selection logic.
Technical Highlights:
• Adaptive coupling design method and waterproof/dustproof design.
• Low-power standby and coil selection logic.
AR glasses
Application scenario: Lightweight AI and AR glasses, providing customers with relevant product solutions and high-quality assembly to create an immersive spatial interaction experience.
Technical Highlights:
• Adjustable rotating shaft, enabling personalized fit.
• The injection molding of metal inserts enhances the structural strength.
VR headset product
Application scenario: A product with high light transmittance for VR head-mounted devices.
Technical Highlights:
• It offers a wide range of color options and enhanced visual clarity.
• The 20-layer membrane stack design enables high transmittance at multiple angles and across multiple bands.
• High surface precision meets the strict requirements of environmental testing.
XR Component
Application scenario: Wearable components provided for XR customers.
Technical Highlights:
• The robust and flexible structure is suitable for wearable applications.
• Advanced manufacturing technologies, including integrated cold and hot pressing technology for flexible materials, automatic edge wrapping and multi-layer bonding, thermoforming and self-developed hot cutting technology, as well as 5-axis laser cutting and dispensing systems.
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Images and Displays
Smartphone display module
Application scenario: Display core module of smart phone.
Technical Highlights:
• High impact resistance and water resistance.
• High precision lamination and curing process ensures dimensional accuracy and structural strength.
Smartphone camera stand
Application scenario: Structural component used for fixing camera module.
Technical Highlights:
• Anti-vibration, enabling stable imaging performance.
• High flatness control of thin walls.
Smartphone camera ring
Application scenario: Decorative parts for the camera of a smart phone.
Technical Highlights:
The assembly is made with glass and camera module, combined with curved high-gloss mirror surface polishing, enhancing the overall aesthetic design of the camera.
Technical Highlights:
The assembly is made with glass and camera module, combined with curved high-gloss mirror surface polishing, enhancing the overall aesthetic design of the camera.
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Sensors and related modules
Smart translation pen housing
Application scenario: It is the most important component of the translation pen, and it is assembled by metal parts and two-color injection molded parts.
Technical Highlights:
• Full-process self-manufacturing production capacity.
• High degree of automation.
Technical Highlights:
• Full-process self-manufacturing production capacity.
• High degree of automation.
Notebook computer touchpad module
Application scenario: Touch panel module supporting multi-point touch gestures and pressure sensing interaction.
Technical Highlights:
• Provide realistic tactile feedback.
• 3D touch technology equipped with linear motor vibration simulation.
• Precise control of differences.
Technical Highlights:
• Provide realistic tactile feedback.
• 3D touch technology equipped with linear motor vibration simulation.
• Precise control of differences.
Keyboard reflective module products
Application scenario: Key modules in laptop computer keyboards used for reflection, conduction, shading and heat dissipation.
Technical highlights: Multi-station connection die-cutting process, enhancing efficiency, output and performance.
Technical highlights: Multi-station connection die-cutting process, enhancing efficiency, output and performance.
Keyboard component solution
Application scenario: The entire processing of various components of the keyboard is completed in one piece, including reflective sheets, light guide plates, membranes, domes, etc.
Technical Highlights:
• The relevant production lines of the company have a high degree of automation, and the consistency of the products is also quite high.
• Integrated production without any intermediate steps can effectively reduce the product cost.
Technical Highlights:
• The relevant production lines of the company have a high degree of automation, and the consistency of the products is also quite high.
• Integrated production without any intermediate steps can effectively reduce the product cost.
Precise metal components of sensors
Application scenario: Metal cover for the atmospheric pressure sensor module to protect the sensor chip.
Technical Highlights:
• Provide strong protection for the sensor chip.• High-precision laser drilling of small holes process.
Mobile phone button - Silence button
Application scenario: Function keys on a smart phone.
Technical Highlights:
• Provide stable tactile feedback and reliable button functions.• The breakthrough achieved by HAF adhesive assembly technology in the field of micro-components.
Keyboard module
Application scenario: Key components of a laptop computer.
Technical Highlights:
• High assembly accuracy and durability, with a complete one-stop processing throughout the process, without any intermediate steps.Hide
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